SanDisk and Toshiba have been collaborating for quite some time to develop flash technologies. The latest breakthrough by them are the 43nm X4 and 32nm X3 flash chips, currently showcased at the International Solid State Circuits Conference (ISSCC).
The 32nm 32Gb X3 flash chip is the smallest NAND flash in the industry and is expected to bring great advancements to the storage products, from memory cards to SSDs. The die is small enough to fit into the size of a microSD card, offering twice the space of 43nm microSD while maintaining a similar die area.
On the other hand, X4 flash memory will enter mass production. It uses 43nm manufacturing process that enables 64Gb (gigabit) memory on a single die, making it the highest density and capacity X4 memory to enter into production this year. The chips can write data at 7.8MB/sec making it at par with Multi-level cell (MLC) technologies.