Samsung has developed the world’s thinnest multi-die memory package that is just 0.6mm thick and packs a whopping 32GB of storage. The new memory package is 40 percent thinner and lighter compared to the conventional memory packages stacked with eight chips. The ultra-thin package consists of eight dies (chips) of 4GB NAND flash that are stacked together using 30nm process and potentially allows to double the storage in the same form factor. Most devices use chips measuring 30um but the latest memory package from Samsung measures just 15um.
No word on the mass production or the tentative price.