At the ongoing Snapdragon Tech Summit, Qualcomm unveiled its next flagship mobile platform and 765/765G 5G integrated platform. Next year will be the year of 5G, and Snapdragon’s two new 5G mobile platforms focus on 5G and AI for 2020. The flagship Snapdragon 865 Mobile Platform includes the Snapdragon X55 Modem-RF System, the world’s most advanced global 5G platform. And the Snapdragon 765/765G brings integrated 5G connectivity, AI processing and select Qualcomm Snapdragon Elite Gaming experiences. Besides this, the new platforms also feature 3D Sonic Max, the latest version of our ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area that is 17x larger than the previous generation, allowing for increased security via simultaneous two-finger authentication, increased speed and ease of use.
Many smartphone manufacturers and carriers have announced to use the new mobile platforms for 2020. The first carriers announcing the support of the certification program for Snapdragon Modular Platforms are Verizon and Vodafone, with more expected in 2020.
In 2020 Q1, OPPO and Xiaomi will launch its flagship product using the Snapdragon 865 mobile platform. Xiaomi’s first flagship of 2020, the Mi 10 will feature the Snapdragon 865 mobile platform. Besides OPPO and Xiaomi, Motorola and Nokia will also be using Qualcomm’s new mobile platforms for their Android devices.