Samsung has developed industry’s first ePoP memory module that stacks a 3GB RAM, 32GB storage (eMMC) and a controller into a single package. ePoP or embedded package on package enables smartphone manufacturers save on space in phones that can be used for other components like a larger battery pack. The package can be stacked on top of the mobile processor and takes about 40 percent less space compared to two-package eMCP memory solutions. The ePoP takes about 225 square millimeters whereas conventioanl PoP takes 374.5 square millimeters.
Despite the compact size, Samsung claims the package does not compromise on performance and the integrated 3GB LPDDR3 mobile DRAM operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.
The memory package solution is available to smartphone and tablet manufacturers and if we were to guess, ePoP could make its way into Samsung’s Galaxy S6 next month.