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Dell intros fleet of products for businesses, confirms 10-inch Win7 tablet

February 9, 2011 By Kunal Gangar Leave a Comment

  Dell has made its largest ever introduction by unveiling 24 new products meant for businesses. These products range from laptops in the Latitude range to desktops in the OptiPlex as well as Precision family. The new unveilings include regular notebooks to rugged ones like the Latitude E6420 ATG and even an XT3 convertible tablet. […]

Filed Under: Hardware, Laptops

TI OMAP 5 platform will bring 2GHz dual core CPUs, 3D to mobile devices

February 7, 2011 By Kunal Gangar Leave a Comment

  TI is looking to up the game in the System-on-Chip arena with the newly announced OMAP 5 platform. The new platform is touted to create “disruptive mobile experiences” in the next-generation mobile devices like smart phones, tablets etc by integrating two 28nm-based ARM Cortex-A15 processors that helps to increase computing performance by 3x and […]

Filed Under: Hardware

WD’s USB 3.0 external HDD line now available in India

February 4, 2011 By Kunal Gangar Leave a Comment

  WD has brought its updated external HDD line to the Indian market. They’ve introduced the My Passport Essential, My Passport Essential SE portable hard drive and My Book Essential HDD, all equipped with the latest SuperSpeed USB 3.0. Users will be able to transfer data to USB 3.0-compatible PCs at speeds to up to […]

Filed Under: Hardware, USB

Nvidia Tegra 3 will bring quad-core goodness to phones and tablets

January 24, 2011 By Kinjal Sangoi Leave a Comment

  So Tegra 2 3D display is not the only thing Nvidia is preparing in the Tegra lineup. The leaked slide that shows the Tegra roadmap reveals Nvidia is developing Tegra 3. Tegra 3 will be a power horse that will bring smartphones and tablets close to PC performance with its quad-core Cortex A9 that […]

Filed Under: Hardware, Rumors

Leaked slide reveals Nvidia’s Tegra 2 3D plans

January 24, 2011 By Kinjal Sangoi Leave a Comment

  The rumored Tegra 3 might not happen at this year’s MWC as Nvidia has been caught with some other plan. In a leaked slide acquired by TechEye, Nvidia will apparently announce Tegra processors supporting 3D display. The processor will be based on the same dual-core Cortex A9 but will be overclocked to 1.2GHz and […]

Filed Under: Hardware, Rumors

LG introduces sleek E2290V LED LCD monitor in South Korea

January 17, 2011 By Kunal Gangar Leave a Comment

  LG Electronics has announced a new sleek monitor for its home market. The Flatron E2290V is touted as the world’s thinnest monitor measuring just 7.2mm. Despite the thinness, the monitor does not lose any functionality. It comes in a luxurious metallic design and supports full HD resolution, has a contrast ratio of 1000000:1, 2ms […]

Filed Under: Hardware

Dell India unveils printers for businesses

January 14, 2011 By Kunal Gangar 1 Comment

  Dell has announced their first set of printers aimed at Indian small and medium businesses. The initial range includes a variety of color/monochrome laser and multifunctional printers that promises to deliver good print quality in less time and cost. Dell printers price start from an affordable Rs.6500 and go up to Rs.30,000. Although priced […]

Filed Under: Hardware

Sony will buyback production line from Toshiba

December 23, 2010 By Kinjal Sangoi Leave a Comment

  Sony has decided to buy back its facility from Toshiba which they had sold in 2008 as part of its asset light strategy. Sony plans to use this purchase to compensate the acute shortage of CMOS sensors that are used to in Sony’s digital cameras and Sony Ericsson phones. Sony is currently the second-largest […]

Filed Under: Hardware

LG touts its 7.2mm slim LED monitor

December 14, 2010 By Kunal Gangar Leave a Comment

  LG has announced an ultra-thin LED monitor that is the slimmest LG has ever created. The E90’s slimness measures at just 7.2mm and will sell under LG’s new Super LED monitor line. The monitor features 2ms response time, integrated Image Booster software to reduce blurriness, up to 40 percent less power consumption when compared […]

Filed Under: Hardware

Samsung creates 8GB DDR3 DRAM using 3D-TSV technology

December 7, 2010 By Kunal Gangar Leave a Comment

  Samsung has developed a new 8GB RDIMM memory module using three-dimensional (3D) chip stacking technology. The stacking technology which is also known as ‘through silicon via’ (TSV) helps to save up to 40 percent of power as compared to a conventional RDIMM module whereas at the same time increase the DRAM density by more […]

Filed Under: Hardware

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