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You are here: Home / Technology / Samsung to ship Multi-chip package with PRAM for mobile devices

Samsung to ship Multi-chip package with PRAM for mobile devices

April 28, 2010 By Samsung Hub Leave a Comment

pram

 

Samsung has announced to ship industry’s first Multi-chip package (MCP) with PRAM from this quarter. The PRAM touted as the next successor of NOR flash is apt for use in mobile handsets and the new MCP-based 512Mbit PRAM is said to be backward compatible with 40nm-class NOR flash memory.

PRAM uses phase change characteristics to store the data that combines the non-volatility of a flash memory and speed of DRAM. Its claimed to provide three times faster data storage than NOR flash chips.

Samsung says simple cell structure makes designing MCP chips easier and faster and will be able to take advantage of 30nm-class process in the near future.

Note: This post has been republished from Samsung Hub. For more Samsung news, head over to Samsung Hub.

  • Samsung will show flexible displays at CES 2013
  • Samsung starts volume production of high-speed NAND flash memory for mobile devices
  • Samsung develops 32GB load-reduced RAM module for server applications
  • Samsung develops 2MP image sensor with full HD support

Filed Under: Technology

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